About the program

"Electronics and Communication Engineering is not just a program; it’s a journey of innovation and connectivity, where we design and develop cutting-edge technologies that drive the future of communication and electronic systems."
Key Aspects of What Electronics and Communication Engineers Do Include:
Design and Verification using Verilog & Xilinx Tools

Design and Verification using Verilog & Xilinx Tools

Schematic and Layout Design of VLSI Circuits

Schematic and Layout Design of VLSI Circuits

Embedded Systems and IoT

Embedded Systems and IoT

RF and Microwave Devices

RF and Microwave Devices

Electronics Circuit Design

Electronics Circuit Design

Prototyping and Testing

Prototyping and Testing

Course Roadmap

Course Roadmap

Industry Training

“Bridging Knowledge to Industry Excellence, industry training paving the Way for Industry Prowess.”
Industrial training is a cornerstone for honing the skills of engineering graduates. It exposes them to the latest technologies, methodologies, and industry best practices, ensuring that they are well-prepared for their future career challenges.
Technical Workshop on Embedded & IoT
Technical Workshop on Embedded & IoT
ASIC Design Flow
ASIC Design Flow
Training on Embedded & IoT
Training on Embedded & IoT
Metamaterial Antenna and MIMO cognitive radio systems
Metamaterial Antenna and MIMO cognitive radio systems for 5G Applications
Machine Learning
Machine Learning
Equipping for the New Corporate
Equipping for the New Corporate

Training Roadmap

1st / 2nd Sem
Problem-Solving

Skill Set : C, C++ Language

No. of Hours : 20

Outcome : Logic Building using Programming language

3rd Sem
Electronics Circuit Design

Skill Set : Simulation of Electronic Circuits

No. of Hours : 40

Outcome : Complete Understanding of SPICE Circuit Simulation

4th Sem
Microcontroller and Embedded Systems

Skill Set : Microcontroller hardware circuits & PCB Design

No. of Hours : 40

Outcome : Implementation of Microcontrollers and Routing, Tracing & Etching for PCBs

5th Sem
VLSI Design using SPICE Modelling

Skill Set : Simulation of Electronic Circuits

No. of Hours : 40

Outcome : SPICE Modelling of Analog and Digital Circuits

|
Front-End VLSI Design

Skill Set : Simulation & Implementation of Digital Hardware

No. of Hours : 40

Outcome : HDL based Modelling and FPGA Implementation

|
Back-End VLSI Design

Skill Set : Design of CMOS Cricuits using Cadence Tools

No. of Hours : 40

Outcome : Schematic and Layout Design of VLSI Circuits

|
Embedded Systems and IOT - I

Skill Set : Interfacing of Sensors in IoT systems

No. of Hours : 40

Outcome : Hardware Implementation of IoT Systems

6th Sem
VLSI Design using SPICE Modelling

Skill Set : Simulation of Electronic Circuits

No. of Hours : 40

Outcome : SPICE Modelling of Analog and Digital Circuits

|
Front-End VLSI Design

Skill Set : Simulation & Implementation of Digital Hardware

No. of Hours : 40

Outcome : HDL based Modelling and FPGA Implementation

|
Back-End VLSI Design

Skill Set : Design of CMOS Cricuits using Cadence Tools

No. of Hours : 40

Outcome : Schematic and Layout Design of VLSI Circuits

|
Embedded Systems and IOT - II

Skill Set : Hardware based on ESP & ARM

No. of Hours : 40

Outcome: Hardware Implementation of IoT Systems

Top Achievers

“All great achievements have one thing in common - people with a passion for success”.

Ms. Devanshi Chauhan

B.Tech - 2019-2023 (ECE)

AKTU Rank-06

Mr. Vipul Mittal

B.Tech - 2011-2015 (ECE)

AIR - 29 (UPSC ESE - 2023)

Ms. Sakshi Gusain

B.Tech 2018-2022 (ECE)

Msc in Data Science for Marketing., Audencia Business School, Paris, France

Ms. Darshika Srivastava

B.Tech - 2016-2020 (ECE)

MSc in Northeastern University, Boston, Massachusetts (USA)

Placement

glimpses

2024

137

Total number of actual placements.

10.20 LPA

Highest salary package offered.

155

Total number of companies that visited for placements of ECE

76.54%

Placement percentage of ECE department.

184

Total number of placements offered by the college.

19

Total number of dream offers ( <=999999 and>=700000 )with remarkable CTC and the corresponding amount in LPA

(CTC >= 10 LPA)

3

Total number of super-dream (>=1000000) offers with exceptionally high CTC and the corresponding amount in LPA.

14

Total number of super offers (<=699999 and>=500000) with excellent CTC and the corresponding amount in LPA.

Top Internship Offers

Sofcon Training Logo
Lutron Logo
We Skill Logo
SMS Group Logo

Top Placement Companies

Centilytics Logo
HikeEdu Logo
Data Trained Logo
Hexaware Logo
Skolar Logo

Industry Partnerships & MoUs

Facilities and Labs

NI innovation Centre

NI innovation Centre

Optical, Microwave and Antenna Design Lab

Optical, Microwave and Antenna Design Lab

VLSI Design Lab

VLSI Design Lab

Embedded & IoT Lab

Embedded & IoT Lab

Project Lab

Project Lab

Electronics Workshop PCB & Measurement Lab

Electronics Workshop PCB & Measurement Lab

Digital Electronics & Microprocessor Lab

Digital Electronics & Microprocessor Lab

Wireless Sensor Network Lab

Wireless Sensor Network Lab

Events & News

ICSEIST-23 Technically Sponsored by IEEE
ICSEIST-23 Technically Sponsored by IEEE
The 1st International Conference on Sustainable Emerging Innovations in Engineering and Technology (ICSEIST-23), technically sponsored by IEEE and funded by MeitY & SERB, was successfully organized. The total number of papers presented and session chairs were 173 and 52, respectively. The Chief Guest at this conference was Prof. (Dr.) D.S. Chauhan, Pro-Chancellor, GLA Mathura, and the Guest of Honour was Prof. (Dr.) B.K. Kaushik, IIT Roorkee.
Expert Session on “Campus to Corporate in VLSI Design”
Expert Session on “Campus to Corporate in VLSI Design”
In this expert session, students gained deep insights into the semiconductor industry, including its current trends, challenges, and prospects. Students were equipped with practical skills and knowledge in VLSI design and implementation, aligning with industry standards and requirements.
Expert Lecture on
Expert Lecture on "Significance of IPR and its Transition"
Speaker Ms. Reema Mediratta, Head of Innovation-Technology Transfer Office, FITT, IIT Delhi, emphasized different forms of intellectual property protection in terms of their key differences and similarities. Students learned about the statutory, procedural, and case law underlying these processes and their interplay with litigation, gaining clarity on common myths of patents.
“National Engineers’ Week” Celebration
“National Engineers’ Week” Celebration
The International Student Chapter “ABESEC OPTICA” (formerly ABESECOSA) organized National Engineers’ Week. The National Engineers' Week created a dynamic learning environment, bridging the gap between theoretical knowledge and practical applications. By incorporating a variety of events and engaging professionals, students were inspired to foster a sense of community within the department, contributing to the holistic development of future engineers in the field of Electronics and Communication Engineering.